Customer Application Center and launches aReady.YOURS SAN DIEGO, CA, UNITED STATES, March 13, 2026 /EINPresswire.com/ — March 10, 2026 * * * congatec – the leading provider of embedded and edge ...
Scalable Edge Performance for Demanding Applications SAN DIEGO, CA, UNITED STATES, March 13, 2026 /EINPresswire.com/ -- ...
At embedded world 2026 on the DigiKey booth, Lucy Barnard spoke with Ravindra Singh, Product Manager for Radio Modules and ...
The COM-HPC® Revision 1.3 specification from PICMG updates the Computer-on-Module standard with support for PCI Express Gen 6 ...
At embedded world 2026 on the DigiKey booth, Lucy Barnard spoke with Mike Fitton, Vice President and General Manager at Altera, about NPIs, overall business updates, industry trends, and more. Altera ...
We just reported that the AMD Ryzen AI Embedded P100 series has been expanded with six additional SKUs, and, timed with that, SolidRun has announced ...
The Register on MSN
Ayar Labs taps Wiwynn to cram 1,024 GPUs into a photonic rack system
Reference design to stitch more than a thousand accelerators into a single enormous server. Exclusive If you thought Nvidia or AMD's 72-GPU rack systems were enormous, silicon Ayar Labs has something ...
"The addition of the CIB-ATI640 provides LYNRED ATI640 users with a streamlined solution to process, analyze, record, and stream thermal video data using Z3's Mission Ready camera video encoder ...
Silicon Motion to Showcase AI-Optimized Boot Storage and Enterprise Solutions at Embedded World 2026
Silicon Motion will exhibit at Embedded World 2026, taking place March 10–12 in Nuremberg, Germany, where attendees can visit Stand 385 in Hall 1 to learn more about its boot storage and controller ...
Power-efficient Intel Atom x7000 processors bring DDR5 memory, high-speed connectivity, and up to 8-core performance to ...
The new family of chips, totaling 11 SKUs, expands Intel's embedded and edge portfolio. Each processor takes a uniform approach: an all-P-core design that discards the ...
New UFS portfolio combines high throughput, compact BGA form factor, and extended temperature support up to Automotive ...
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