The performance and reliability of an electronics system largely depend on the system’s immunity from an electrostatic discharge (ESD) event. Because the components, custom chips and package come from ...
The Industry Council on ESD Target Levels, since its inception in 2006, has strongly influenced the IC industry’s ESD qualification processes. The industry’s original ESD qualification requirements ...
The state-of-the-art in robustness design and analysis for ESD (electrostatic discharge) always lags our ability to characterize and qualify a device or system. The ESD Association, IEC, JEDEC, and ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Apache Design Solutions, the technology leader in power integrity and noise closure for chip-package-systems (CPS) convergence, today announced PathFinder™, a ...
Chip-Package-System (CPS) ESD simulation enables system-wide ESD robustness validation, a common challenge in automotive and aerospace applications. To enable CPS ESD analysis requires an accurate ...
Electronic system designs often include transient protection to ensure system robustness for electrostatic discharge (ESD) events. Adding external ESD protection without compromising system I/O speed, ...
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