ROHM Semiconductor today announced it has begun online sales of new SiC molded modules: TRCDRIVE pack™, HSDIP20 and DOT-247. Amid growing concerns over tightening global power supply and the ...
Infineon gives vertical power delivery a push with a new generation of multiphase power modules that can be tucked underneath ...
Micron Technology (NasdaqGS:MU) has begun shipping customer samples of its 256 GB SOCAMM2 LPDRAM module for AI data centers.
ARLINGTON, Va., October 20, 2025--(BUSINESS WIRE)--JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is ...
Shrinking available board space in next-generation server and telecom system power-delivery applications led to Fairchild Semiconductor’s development of the smart power stage (SPS) module family. The ...
Micron squeezes 64 32GB LPDDR5x chips into one module ...
Micron Technology has started customer sampling of its new 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), a low-power DRAM module designed for AI data centers. Save my User ID and ...
Competition in the AI semiconductor market is expanding beyond high bandwidth memory (HBM) to server low-power dynamic random ...
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