AZOM

Advancements in Plasma Etching and Deposition Processes for Compound Semiconductor Materials Applications

In this interview, AZoM talks to Bas Derksema about advancements in plasma etching and deposition processes for compound semiconductor materials applications. Please could you introduce yourself and ...
Metal AM magazine

Norsk and Airbus partner to advance Rapid Plasma Deposition technology

Norsk Titanium and Airbus to jointly develop DED Additive Manufacturing process for Norsk Titanium’s Rapid Plasma Deposition ...
AZOM

Accelerating New Material Development with Streamlined Research to Scale Particle Atomic Layer Deposition Process

For the first time in history, a pathway for ALD-enhanced materials to be rapidly developed and transitioned from lab-scale to commercial production is available for nearly any application. Until ...
Semiconductor Engineering

A Deposition And Etch Technique To Lower Resistance Of Semiconductor Metal Lines

Copper’s resistivity depends on its crystal structure, void volume, grain boundaries and material interface mismatch, which becomes more significant at smaller scales. The formation of copper (Cu) ...
Semiconductor Engineering

Design of Selective Deposition Processes For Nanoscale Electronic Devices

A technical paper titled “Quantified Uniformity and Selectivity of TiO 2 Films in 45-nm Half Pitch Patterns Using Area-Selective Deposition Supercycles” was published by researchers at IMEC, North ...